Lokesh Siddhu

Latest

• CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems
• The paper 'CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory System' was accepted for ACM Transactions on Architecture and Code (TACO).
• CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems