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The paper 'Lifetime Estimation for Core-Failure Resilient Multi-Core Processors' was accepted for IEEE MCSoC '23.
The paper '3D-TTP: Efficient Transient Temperature-Aware Power Budgeting for 3D-Stacked Processor-Memory Systems' was accepted for publication at IEEE ISVLSI '23.
The patent 'Power management for multicore processors' has been successfully published under number EP 4 152 124.
The paper 'Thermal Management for S-NUCA Many-Cores via Synchronous Thread Rotations' was accepted at DATE 2023.
T-TSP
The paper 'T-TSP: Transient-Temperature Based Safe Power Budgeting in Multi-/Many-Core Processors' was accepted for IEEE ICCD 2021.
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