CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems

Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, A. Pathania, Jörg Henkel, Preeti Ranjan Panda
September 2022
DOI
Type
Journal article
Publication
ACM Transactions on Architecture and Code Optimization