The Multi-Partner Project paper 'Collaborative Innovation in 3D VLSI Reliability (COIN-3D)' will be presented at DATE 2026.
George Rafael Gourdoumanis,
Fotoini Oikonomou,
Maria Pantazi-Kypraiou,
Pavlos Stoikos,
Olympia Axelou,
Athanasios Tziouvaras,
Georgios Karakonstantis,
Tahani Aladwani,
Christos Anagnostopoulos,
Yixian Shen,
Anuj Pathania,
Alberto Garcia-Ortiz and George Floros
Dec 29, 2025